COATINGS-IVD-PVD-SPUTTERING PROCESS QUESTIONNAIRE ~ TEST






    Name (required)

    Title (required)

    Company (required)

    Date (required)

    Street, P.O. Box (required)

    City, State, Country, Zip/Postal Code (required)

    Phone#(required)
    Office Phone#

    Mobile Phone

    Fax#

    Email Address (required)

    When Needed (required)

    Price Range

    Industry:(required)
    SEMICONDUCTOROPTICALMETALLURGICAL
    Other

    Type Of Activity:
    Research & Development(R&D)Production

    Primary Vacuum-Controlled Atmosphere Coating Processes Desired:
    Ion Vapor Deposition (IVD)Physical Vapor Deposition (PVD)Electron Beam (EB)SputteringIon Beam Assist Deposition (IBAD)Cathodic Arc Deposition (CAD)

    Other

    1. Film Materials/ Thicknesses (angstroms)
    a. /
    b. /

    2. Which of these materials to be co-deposited, if any?
    a.
    b.

    3. Substrate Material:

    3a. Number of substrate sides to be coated:

    4. Size of Substrates (required): inchesmillimeters
    Height by Width Thickness
    Diameter by Thickness

    5. Estimated throughput quantity processed: /week

    5a. Is this a new process for you? yesno

    5b. If not a new process, what are you using now?
    Make/Model

    6. Above throughput on 123 shift basis

    7. Temperature of substrates:
    Preheatdeg. C
    Duringdeg. C

    8. Type of high vacuum pumping:
    DiffusionCryopumpTurbomolecular
    Other

    9. Automated Computer Control?yesno

    9a. Automatic Vacuum System control only?yesno

    9b. Manual control only?yesno

    10. Desired vacuum level prior to process:torr

    10a. Desired vacuum level during process:torr

    11.Utilities available:
    VAC Phase Hz
    Water – CityWater – ChilledLiquid Nitrogen
    Compressed Airpsig